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  2048-pixel ccd linear sensor (b/w) description the ILX751A is a reduction type ccd linear sensor designed for facsimile, image scanner and ocr use. this sensor reads b4 size documents at a density of 200dpi (dot per inch). featuring a shutter function, correspondences with the sensitivity correction, etc, is possible. a built-in timing generator and clock- drivers ensure direct drive at 5v logic for easy use. features number of effective pixels: 2048 pixels pixel size: 14m 14m (14m pitch) built-in timing generator and clock-drivers shutter function ultra low lag maximum clock frequency: 5mhz absolute maximum ratings supply voltage v dd1 11 v v dd2 6v operating temperature ?0 to +55 ? storage temperature ?0 to +80 ? pin configuration (top view) block diagram ?1 e00440-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. ILX751A 22 pin dip (cer-dip) 22 20 17 16 15 14 13 12 10 9 11 4 21 19 5 8 7 6 3 2 1 v out output amplifier sample-and-hold circuit v dd2 18 nc v dd1 gnd nc nc nc nc gnd nc f shut f rog shsw v dd2 gnd f clk v dd2 nc nc nc nc clock pulse generator sample-and-hold pulse generator mode selector read out gate pulse generator shutter gate pulse generator clock-drivers ccd analog shift register read out gate shutter gate d14 d15 s1 d33 s2 s2047 s2048 d34 d35 d36 d37 d38 d39 shutter drain 1 22 v out 2 nc 3 nc 4 shsw 5 f clk 6 nc 7 nc 8 v dd2 9 f shut 10 nc 11 21 20 19 18 17 16 15 14 13 12 f rog v dd2 v dd2 v dd1 gnd nc gnd nc nc nc nc gnd 1 2048
? 2 ILX751A unit pf pf pf max. typ. 10 10 10 min. symbol c f clk c f rog c f shut item input capacity of f clk pin input capacity of f rog pin input capacity of f shut pin input capacity of pins item unit v v max. 9.5 5.25 typ. 9.0 5.0 min. 8.5 4.75 item v dd1 v dd2 recommended supply voltage pin condition pin 4 shsw gnd v dd2 mode in use s/h yes no mode description unit v v max. 5.5 0.5 typ. 5.0 min. 4.5 0.0 input clock high level input clock low level recommended input pulse voltage pin description pin no. symbol description 1 2 3 4 5 6 7 8 9 10 11 v out nc nc shsw f clk nc nc v dd2 f shut nc f rog signal output nc nc with s/h ? gnd switch without s/h ? v dd 2 clock pulse nc nc 5v power supply shutter pulse nc clock pulse pin no. symbol description 12 13 14 15 16 17 18 19 20 21 22 gnd nc nc nc nc gnd nc gnd ' v dd1 v dd2 v dd2 gnd nc nc nc nc gnd nc gnd 9v power supply 5v power supply 5v power supply note) rules for raising and lowering power supply voltage to raise power supply voltage, first raise v dd1 (9v) and then v dd2 (5v). to lower voltage, first lower v dd2 (5v) and then v dd1 (9v). {
? 3 ILX751A unit remarks max. 50 8.0 2.0 3.0 8.0 5.0 5.0 typ. 40 2.0 1.8 0.3 0.5 0.02 6000 0.045 4.0 1.8 97.0 600 4.0 1.0 min. 30 1.5 92.0 0 symbol r prnu v sat v drk dsnu il dr se i vdd1 i vdd2 tte z o v os shut item electrooptical characteristics (ta = 25 c, v dd1 = 9v, v dd2 = 5v, clock frequency = 1mhz, light source = 3200k, ir cut filter: cm-500s (t = 1.0mm)) notes) 1. for the sensitivity test light is applied with a uniform intensity of illumination. 2. prnu is defined as indicated below. ray incidence conditions are the same as for note 1. prnu = 100 [%] the maximum output is set to v max , the minimum output to v min and the average output to v ave . 3. integration time is 10ms. 4. v out = 500mv 5. dr = when optical accumulated time is shorter, the dynamic range gets wider because dark voltage is in proportion to optical accumulated time. 6. se = 7. vos is defined as indicated below. (v max ?v min )/2 v ave v sat r g n d o s d 3 1 d 3 2 d 3 3 s 1 v o s       v/(lx ?s) % v mv mv % lx ?s ma ma % v % note 1 note 2 note 3 note 3 note 4 note 5 note 6 note 7 note 8 secsitivity sensitivity nonuniformity saturation output voltage dark voltage average dark signal nonuniformity image lag dynamic range saturation exposure 9v supply current 5v supply current total transfer efficiency output impedance offset level shutter lag v sat v drk
? 4 ILX751A 8. to stipulate the lag during shutter operation, use the formula below. place the output voltage average value during shutter operation at v shut and the output voltage average value when the shutter is not in operation at v ave . (refer to fig. 5.) shut = 100 [%] please note that the shutter pulse at this time accord with fig. 5. v shut v ave
? 5 ILX751A fig. 1. clock timing diagram (without s/h mode) d u m m y s i g n a l ( 3 3 p i x e l s ) o p t i c a l b l a c k ( 1 8 p i x e l s ) d u m m y s i g n a l ( 6 p i x e l s ) e f f e c t i v e p i c t u r e e l e m e n t s s i g n a l ( 2 0 4 8 p i x e l s ) 1 - l i n e o u t p u t p e r i o d ( 2 0 8 7 p i x e l s ) 1 d 2 d 3 d 4 d 5 d 6 d 1 1 d 1 2 d 1 3 d 1 4 d 1 5 d 3 1 d 3 2 d 3 3 s 1 s 2 s 3 s 4 s 2 0 4 5 s 2 0 4 6 s 2 0 4 7 s 2 0 4 8 d 3 4 d 3 5 d 3 6 s 3 7 s 3 8 d 3 9 2 3 4 2 0 8 7 1 2 5 f r o g f c l k v o u t 0 5 0
? 6 ILX751A fig. 2. f clk, v out timing                     f c l k t 3 t 4 t 2 t 1 t 5 t 6 v o u t item f clk pulse rise/fall time f clk pulse duty * 1 f clk ?v out 1 f clk ?v out 2 symbol t1, t2 t5 t6 min. 0 40 50 30 typ. 10 50 80 75 max. 60 110 120 unit ns % ns ns fig. 3. f rog, f clk timing f r o g f c l k t 7 t 1 1 t 8 t 1 0 t 9 item f rog, f clk pulse timing f rog pulse rise/fall time f rog pulse period symbol t7, t11 t8, t10 t9 min. 500 0 500 typ. 1000 10 1000 max. unit ns ns ns * 1 100 t3/(t3 + t4)
? 7 ILX751A fig. 4. f shut timing f s h u t t 1 2 t 1 4 t 1 3 item f shut pulse rise/fall time f shut pulse period symbol t12, t13 t14 min. 0 500 typ. 10 1000 max. unit ns ns
? 8 ILX751A fig. 5. shutter operation mode clock 2 0 8 7 b i t s o r m o r e l i g h t s o u r c e o n 1 m s 5 0 f r o g 5 0 f c l k 5 0 * d u r i n g s h u t t e r l a g e v a l u a t i o n , t h e l i g h t s o u r c e w i l l b e a c c o m p a n i e d b y a f l a s h . f s h u t i l l u m i n a t i o n *
? 9 ILX751A fig. 6. shutter pulse and output voltage o n 5 v 0 v f r o g i l l u m i n a t i o n f s h u t v o u t 5 v 0 v o f f o n o n s h u t t e r o n v a v e v s h u t o f f o f f
? 10 ILX751A * description of shutter pin 9 1) the state at 5v is when the shutter is not in operation. 2) when dropped to 0v, the shutter gate will open, letting the accumulated charge of the sensor be thrown away to the shutter drain.                             t h e c h a r g e i s s e n t t o t h e t r a n s f e r r e g i s t e r a s s i g n a l c h a r g e . t h e c h a r g e u p t o t h i s p o i n t w i l l b e t h r o w n a w a y t o t h e s h u t t e r d r a i n . s h u t t e r g a t e o n 5 v f r o g f s h u t a c c u m u l a t e d c h a r g e o f t h e s e n s o r 0 v 5 v 0 v
? 11 ILX751A example of representative characteristics d a r k s i g n a l v o l t a g e r a t e v s . a m b i e n t t e m p e r a t u r e ( s t a n d a r d c h a r a c t e r i s t i c s ) 1 0 5 1 d a r k s i g n a l v o l t a g e r a t e 0 . 5 0 . 1 0 1 0 2 0 3 0 t a a m b i e n t t e m p e r a t u r e [ c ] 4 0 5 0 6 0 v d d 1 , v d d 2 s u p p l y c u r r e n t v s . c l o c k f r e q u e n c y ( s t a n d a r d c h a r a c t e r i s t i c s ) 1 0 i v d d 1 t a = 2 5 c i v d d 2 5 1 i v d d 1 , i v d d 2 v d d 1 , v d d 2 s u p p l y c u r r e n t [ m a ] 0 . 5 0 . 1 0 . 1 m 1 m c l o c k f r e q u e n c y [ h z ] 5 m s p e c t r a l s e n s i t i v i t y c h a r a c t e r i s t i c s ( s t a n d a r d c h a r a c t e r i s t i c s ) 1 . 0 0 . 9 0 . 8 0 . 7 0 . 6 0 . 5 0 . 4 0 . 3 0 . 2 0 . 1 0 r e l a t i v e s e n s i t i v i t y 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 0 0 0 w a v e l e n g t h [ n m ]
? 12 ILX751A application circuit v o u t n c n c s h s w f c l k n c n c v d d 2 ( d ) f s h u t n c f r o g v d d 2 ( d ) v d d 2 ( d ) 1 5 v 9 v 0 . 0 1 1 0 / 1 6 v 2 s a 1 1 7 5 f c l k f s h u t f r o g 2 2 / 1 0 v 0 . 0 1 o u t p u t s i g n a l 3 k v d d 1 ( a ) g n d ( a ) n c g n d ( a ) n c n c n c n c g n d ( d ) 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 1 2 3 4 5 6 7 8 9 1 0 1 1 application circuits shown are typical examples illustrating the operation of the devices. sony cannot assume responsibility fo r any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same .
? 13 ILX751A notes of handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensor. e) for the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) notes on handling ccd cer-dip packages the following points should be observed when handling and installing cer dip packages. a) remain within the following limits when applying static load to the ceramic portion of the package: (1) compressive strength: 39n/surface (do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) shearing strength: 29n/surface (3) tensile strength: 29n/surface (4) torsional strength: 0.9nm b) in addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) be aware that any of the following can cause the glass to crack: because the upper and lower ceramic layers are shielded by low-melting glass, (1) applying repetitive bending stress to the external leads. (2) applying heat to the external leads for an extended period of time with soldering iron. (3) rapid cooling or heating. (4) rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as tweezers. (5) prying the upper or lower ceramic layers away at a support point of the low-melting glass. note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) soldering a) make sure the package temperature does not exceed 80 c. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a grounded 30w soldering iron and solder each pin in less then 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an imaging device, do not use a solder suction equipment. when using an electric desoldering tool, ground the controller. for the control system, use a zero cross type. u p p e r c e r a m i c l a y e r 3 9 n l o w e r c e r a m i c l a y e r l o w - m e l t i n g g l a s s ( 1 ) 2 9 n ( 3 ) 0 . 9 n m ( 4 ) 2 9 n ( 2 )                                          
? 14 ILX751A 4) dust and dirt protection a) operate in clean environments. b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) exposure to high temperatures or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. 6) ccd image sensors are precise optical equipment that should not be subject to mechanical shocks.
? 15 ILX751A package outline unit: mm 1 . t h e h e i g h t f r o m t h e b o t t o m t o t h e s e n s o r s u r f a c e i s 2 . 4 5 0 . 3 m m . 2 . t h e t h i c k n e s s o f t h e c o v e r g l a s s i s 0 . 7 m m , a n d t h e r e f r a c t i v e i n d e x i s 1 . 5 . v h 7 . 3 5 0 . 5 2 2 2 8 . 6 7 2 ( 1 4 m x 2 0 4 8 p i x e l s ) 4 1 . 6 0 . 5 1 1 1 1 2 n o . 1 p i x e l 5 . 0 0 . 5 4 . 0 0 . 5 2 . 5 4 0 . 5 1 3 . 6 5 4 . 3 5 0 . 5 0 . 2 5 0 t o 9 1 0 . 0 0 . 5 0 . 3 2 2 p i n d i p ( 4 0 0 m i l ) m c e r - d i p t i n p l a t i n g 4 2 a l l o y 5 . 2 0 g p a c k a g e s t r u c t u r e p a c k a g e m a t e r i a l l e a d t r e a t m e n t l e a d m a t e r i a l p a c k a g e m a s s d r a w i n g n u m b e r l s - a 1 8 - 0 1 ( e ) sony corporation


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